Comparison of smoothing methods for the analysis of transient thermal resistance

@article{Liu2016ComparisonOS,
  title={Comparison of smoothing methods for the analysis of transient thermal resistance},
  author={Yanan Liu and Zhangfu Chen and Jianhua Zhang and Lianqiao Yang},
  journal={2016 17th International Conference on Electronic Packaging Technology (ICEPT)},
  year={2016},
  pages={1117-1121}
}
In this paper, the analysis of transient thermal resistance is carried out on the basis of the regularization smoothing method and the Fourier series expansion method. These two methods are used to smooth cooling curve under the hypothetical model, and their result of smoothing and derivation are contrasted to the move average smoothing method under the… CONTINUE READING