Comparison of in-situ measurement techniques of solder joint reliability under thermo-mechanical stresses

@article{Duan2014ComparisonOI,
  title={Comparison of in-situ measurement techniques of solder joint reliability under thermo-mechanical stresses},
  author={N. Duan and T. Bach and Jun Shen and R. Rongen},
  journal={Microelectronics Reliability},
  year={2014},
  volume={54},
  pages={1753-1757}
}