Comparative thermal and thermomechanical analyses of solder-bump and direct-solder bonded power device packages having double-sided cooling capability

@article{Bai2004ComparativeTA,
  title={Comparative thermal and thermomechanical analyses of solder-bump and direct-solder bonded power device packages having double-sided cooling capability},
  author={J. Bai and J. N. Calata and Guo-Quan Lu},
  journal={Nineteenth Annual IEEE Applied Power Electronics Conference and Exposition, 2004. APEC '04.},
  year={2004},
  volume={2},
  pages={1240-1246 vol.2}
}
Solder-bump (SB) and direct-solder (DS) interconnections offer the possibility of double-sided cooling for packaging power devices. In this paper, packages with SB and DS bonded power devices were fabricated to investigate their reliability and the effectiveness of double-sided cooling. Thermal and thermomechanical characteristics of both packages were analyzed via temperature cycling experiment and computer simulation by finite element modeling (FEM). Thermal analysis results show that double… CONTINUE READING