Comparative study of different technology of mechanical decap to check excess solder issue — Conventional versus new approaches

Abstract

Mechanical decapsulation is a method of removing mold compound material from a packaged electronic device of the type encapsulated with a protective material that forms an outer surface of the device [1]. Though wet decapsulation is certainly the most common method, it is not appropriate for all types of semiconductor failure analysis. Contaminants on the… (More)

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@article{Ramuhzan2015ComparativeSO, title={Comparative study of different technology of mechanical decap to check excess solder issue — Conventional versus new approaches}, author={Fadhilah Nurani Ramuhzan and Zainal Abas Hasan and Yusnani Muhamad Yusof}, journal={2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits}, year={2015}, pages={96-101} }