Comparative Study of Drop Reliability between Cu and Ni(P)/Au UBM with Sn-3.5Ag-xZn Solders

Abstract

The performance of drop reliability was measured with Sn-3.5Ag-xZn solder joint on Cu and electroless Ni(P)/Au metallization after reflow and thermal aging (150degC, 500 hr). The content of Zn was 0, 1, 3 and 7 wt%. And interfacial reactions were investigated. The presence of Zn affected the type and morphology of IMC and showed the benefits on the drop… (More)

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Cite this paper

@article{Jee2007ComparativeSO, title={Comparative Study of Drop Reliability between Cu and Ni(P)/Au UBM with Sn-3.5Ag-xZn Solders}, author={Y. K. Jee and Y. H. Ko and Jin Yu and T. Y. Lee and M. K. Cho and H. M. Lee}, journal={2007 Proceedings 57th Electronic Components and Technology Conference}, year={2007}, pages={957-961} }