Co-Simulation of IC, Package and PCB Power Delivery Networks in Ultra-Low Voltage Power Rail Designs

Abstract

In this work, a methodology for the co-simulation of integrated circuit (IC), package, and printed circuit board (PCB) for low-power applications is presented. First, it is shown through numerical experiments that system-level characterization achieved by considering the chip, package, and board as autonomous blocks that interact with each other via… (More)

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