Cleavage cracking across triple grain boundary junctions in freestanding silicon thin films

@inproceedings{Chen2008CleavageCA,
  title={Cleavage cracking across triple grain boundary junctions in freestanding silicon thin films},
  author={Jin Chen and Y. Qiaoa},
  year={2008}
}
This article is focused on a fractography study of cleavage cracking at triple grain boundary junctions in freestanding silicon thin films. At a triple junction, as the crystallographic orientations of the two grains ahead of the crack are different by only a few degrees, the cleavage front advance becomes quite jerky. The crack first enters the grain of… CONTINUE READING