Circuit Models of Carbon-Based Interconnects for Nanopackaging

@article{Chiariello2013CircuitMO,
  title={Circuit Models of Carbon-Based Interconnects for Nanopackaging},
  author={Andrea Gaetano Chiariello and Antonio Maffucci and G. Miano},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
  year={2013},
  volume={3},
  pages={1926-1937}
}
This paper proposes an equivalent circuital model to describe the electrical propagation along nanoscale interconnects, made either by carbon nanotubes or graphene nanoribbons. The circuital models are derived from an electrodynamical model for the transport of conduction electrons, and are expressed in the frame of the classical transmission line theory. The per-unit-length parameters, despite their simple expressions, retain the main phenomena occurring at nanoscale, such as the kinetic and… CONTINUE READING
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Temperature effects on electrical performance of carbon-based nano-interconnects at chip and package level

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Carbon nanotube based ultra-low voltage integrated circuits: Scaling down to 0.4 V

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1 Excerpt

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