Chip-to-chip optoelectronics SOP on organic boards or packages

  title={Chip-to-chip optoelectronics SOP on organic boards or packages},
  author={Gee-Kung Chang and D. Guidotti and Fuhan Liu and Yin-Jung Chang and Zhaoran Huang and V. Sundaram and D. Balaraman and S. Hegde and R. R. Tummala},
  journal={IEEE Transactions on Advanced Packaging},
  • Gee-Kung Chang, D. Guidotti, +6 authors R. R. Tummala
  • Published 2004
  • Engineering
  • IEEE Transactions on Advanced Packaging
  • In this paper, we demonstrate compatibility of hybrid, large-scale integration of both active and passive devices and components onto standard printed wiring boards in order to address mixed signal system-on-package (SOP)-based systems and applications. Fabrication, integration and characterization of high density passive components are presented, which includes the first time fabrication on FR-4 boards of a polymer buffer layer with nano scale local smoothness, blazed polymer surface relief… CONTINUE READING
    38 Citations

    Figures and Tables from this paper.

    Polymer-based board-level optical interconnects
    • 2
    Fabrication of low-cost panel sized optical-printed circuit boards
    • 3
    High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems (Invited Paper)
    • 9
    Optical interconnects integration on FR4 board with MSM photodetector and commercial optoelectronic devices
    • Z. Huang, D. Guidotti, +4 authors R. Tummala
    • Materials Science
    • Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004.
    • 2004
    • 1
    Demonstration of Direct Coupled Optical/Electrical Circuit Board
    • 17
    Physical design for 3D system on package
    • S. Lim
    • Engineering, Computer Science
    • IEEE Design & Test of Computers
    • 2005
    • 97
    Demonstration of High Frequency Data Link on FR4 Printed Circuit Board Using Optical Waveguides
    • T. Lim, B. Lee, +6 authors P. Ramana
    • Materials Science
    • 2007 Proceedings 57th Electronic Components and Technology Conference
    • 2007
    • 7
    Limitations to and solutions for optical loss in optical backplanes
    • 50
    Multifunctional integrated substrate technology for high density SOP packaging
    • F. Liu, R. R. Tummala, +8 authors G.K. Chang
    • Engineering
    • Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04)
    • 2004
    • 2
    Flexible opto-electrical interconnect module for consumer electronic application
    • 2


    Material and process challenges in embedding polymeric waveguides and detectors in system on package (SOP)
    • F. Liu, D. Guidotti, +5 authors R. R. Tummala
    • Materials Science
    • 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings.
    • 2004
    • 6
    Planar lightwave integrated circuits with embedded actives for board and substrate level optical signal distribution
    • 17
    Fully embedded board-level guided-wave optoelectronic interconnects
    • 220
    • PDF
    Scaling optoelectronic-VLSI circuits into the 21st century: a technology roadmap
    • 240
    • Highly Influential
    • PDF
    Multichannel ultrathin silicon-on-sapphire optical interconnects
    • 22
    New technology for electrical/optical systems on module and board level: the EOCB approach
    • 69
    Embedded optical interconnections on printed wiring boards
    • 18
    Advances in polymer integrated optics
    • 626