Chip-to-chip optoelectronics SOP on organic boards or packages

@article{Chang2004ChiptochipOS,
  title={Chip-to-chip optoelectronics SOP on organic boards or packages},
  author={Gee-Kung Chang and D. Guidotti and Fuhan Liu and Yin-Jung Chang and Zhaoran Huang and V. Sundaram and D. Balaraman and S. Hegde and R. R. Tummala},
  journal={IEEE Transactions on Advanced Packaging},
  year={2004},
  volume={27},
  pages={386-397}
}
  • Gee-Kung Chang, D. Guidotti, +6 authors R. R. Tummala
  • Published 2004
  • Engineering
  • IEEE Transactions on Advanced Packaging
  • In this paper, we demonstrate compatibility of hybrid, large-scale integration of both active and passive devices and components onto standard printed wiring boards in order to address mixed signal system-on-package (SOP)-based systems and applications. Fabrication, integration and characterization of high density passive components are presented, which includes the first time fabrication on FR-4 boards of a polymer buffer layer with nano scale local smoothness, blazed polymer surface relief… CONTINUE READING
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    References

    SHOWING 1-10 OF 28 REFERENCES
    Material and process challenges in embedding polymeric waveguides and detectors in system on package (SOP)
    • F. Liu, D. Guidotti, +5 authors R. R. Tummala
    • Materials Science
    • 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings.
    • 2004
    • 6
    Planar lightwave integrated circuits with embedded actives for board and substrate level optical signal distribution
    • 17
    Fully embedded board-level guided-wave optoelectronic interconnects
    • 220
    • PDF
    Scaling optoelectronic-VLSI circuits into the 21st century: a technology roadmap
    • 240
    • Highly Influential
    • PDF
    Multichannel ultrathin silicon-on-sapphire optical interconnects
    • 22
    New technology for electrical/optical systems on module and board level: the EOCB approach
    • 69
    Embedded optical interconnections on printed wiring boards
    • 18
    Advances in polymer integrated optics
    • 626