Chip-to-chip optoelectronics SOP on organic boards or packages

@article{Chang2004ChiptochipOS,
  title={Chip-to-chip optoelectronics SOP on organic boards or packages},
  author={Gee-Kung Chang and Daniel Guidotti and Fuhan Liu and Yin-Jung Chang and Zhaoran Huang and Viji Sundaram and Devarajan Balaraman and Shridar Narayan Hegde and R. R. Tummala},
  journal={IEEE Transactions on Advanced Packaging},
  year={2004},
  volume={27},
  pages={386-397}
}
In this paper, we demonstrate compatibility of hybrid, large-scale integration of both active and passive devices and components onto standard printed wiring boards in order to address mixed signal system-on-package (SOP)-based systems and applications. Fabrication, integration and characterization of high density passive components are presented, which includes the first time fabrication on FR-4 boards of a polymer buffer layer with nano scale local smoothness, blazed polymer surface relief… CONTINUE READING

Citations

Publications citing this paper.
SHOWING 1-10 OF 22 CITATIONS

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  • IEEE Transactions on Components and Packaging Technologies
  • 2007
VIEW 6 EXCERPTS
CITES BACKGROUND & METHODS
HIGHLY INFLUENCED

A low cost rigid-flex opto-electrical link for mobile devices

  • 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference
  • 2010
VIEW 1 EXCERPT
CITES BACKGROUND

Demonstration of Direct Coupled Optical/Electrical Circuit Board

  • IEEE Transactions on Advanced Packaging
  • 2009
VIEW 1 EXCERPT
CITES BACKGROUND

Controlling Interfacial Interpenetration of Polymer Waveguide Deposited on Plasma Treated Flexible Substrate

  • 2008 10th Electronics Packaging Technology Conference
  • 2008
VIEW 1 EXCERPT
CITES BACKGROUND

References

Publications referenced by this paper.
SHOWING 1-10 OF 26 REFERENCES

Material and process challenges in embedding polymeric waveguides and detectors in system on package (SOP)

  • 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings.
  • 2004
VIEW 1 EXCERPT

Embedded optical interconnections on printed wiring boards

  • 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)
  • 2003

Micro-board technology development at Georgia Tech—Packaging Research Center

F. Liu, V. Sundaram, +3 authors R. R. Tummala
  • Proc. ICEP, Tokyo, Japan, Apr. 16–18, 2003, pp. 187–192.
  • 2003

private communications

N. M. Jockerst
  • unpublished, 2003.
  • 2003
VIEW 1 EXCERPT

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