Chip package interaction: A stress analysis on 3D IC's packages

@article{Lofrano2015ChipPI,
  title={Chip package interaction: A stress analysis on 3D IC's packages},
  author={Melina Lofrano and M. Bargallo Gonzalez and Wei Guo and Geert Van der Plas},
  journal={2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems},
  year={2015},
  pages={1-9}
}
In this work CPI induced mechanical stress for 3D stacks and 3D interposer packages is studied. The stress built during package assembly has been obtained using finite element modeling (FEM). For the package layout and materials properties chosen for this work, the results shown that the stresses induced during the processing of a 3D stacks and 3D interposer configuration are similar when they are assembled in a Flip Chip Ball Grid Array (fcBGA) package. Furthermore, the interconnection between… CONTINUE READING