Chip-on board technology for low temperature environment. Part II: Thermomechanical stresses in encapsulated ball-wedge bond wires

@article{Jinka2009ChiponBT,
  title={Chip-on board technology for low temperature environment. Part II: Thermomechanical stresses in encapsulated ball-wedge bond wires},
  author={K. K. Jinka and A. Dasgupta and S. Ganesan and S. Ling},
  journal={Microelectronics Reliability},
  year={2009},
  volume={49},
  pages={523-529}
}
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