Chip-To-Package Interconnections

@inproceedings{Totta1997ChipToPackageI,
  title={Chip-To-Package Interconnections},
  author={Paul A. Totta and Subash Khadpe and Nicholas George Koopman and Timothy Clark Reiley and Michael Jay Sheaffer},
  year={1997}
}
Integration of circuits to semiconductor devices, driving the need for improvements in packaging, has been discussed in Chapter 7,“Microelectronics Packaging—An Overview. ” This is further illustrated in Figure 8-1, wherein the cost of interconnecting on silicon is compared with interconnecting on ceramic substrates and on organic boards, clearly showing the lower cost of interconnecting on silicon [1]. Although the trend is toward total integration on Si there is, however, a practical, growing… CONTINUE READING

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