Chip Package Interaction and mechanical reliability impact on Cu/ultra low-k interconnects in Flip Chip package

@article{Uchibori2008ChipPI,
  title={Chip Package Interaction and mechanical reliability impact on Cu/ultra low-k interconnects in Flip Chip package},
  author={C. Uchibori and Xuefeng Zhang and P. S. Ho and Tomoji Nakamura},
  journal={2008 9th International Conference on Solid-State and Integrated-Circuit Technology},
  year={2008},
  pages={1219-1222}
}
The chip package interaction (CPI) induced by the mismatch in coefficient of thermal expansion (CTE) between chip and package in a flip chip ball grid array (FCBGA) and its impacts on the mechanical reliability of Cu/ultra low-k interconnect were investigated using finite element analysis (FEA). 3D and 2D multi-level sub-modeling technique was used to link the deformation from the package level to the interconnect level. The energy release rate (ERR) at the critical interface in interconnect… CONTINUE READING