Chip Package Co-design of 5GHz RF Receiver Front-End Using Multichip Module Technology

Abstract

The transceivers for future technology (third generation cellular, wireless LAN) need to be portable (compact), battery-powered and wireless. The present single-chip solutions for RF front-ends do not yield complete system integration. A system-on-a-package (SoP) approach can solve these problems. High quality components can be integrated in the package… (More)

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