Characterizing within-die variation from multiple supply port IDDQ measurements

@article{Agarwal2009CharacterizingWV,
  title={Characterizing within-die variation from multiple supply port IDDQ measurements},
  author={Kanak Agarwal and Dhruva Acharyya and James F. Plusquellic},
  journal={2009 IEEE/ACM International Conference on Computer-Aided Design - Digest of Technical Papers},
  year={2009},
  pages={418-424}
}
The importance of within-die process variation and its impact on product yield has increased significantly with scaling. Within-die variation is typically monitored by embedding characterization circuits in product chips. In this work, we propose a minimally-invasive, low-overhead technique for characterizing within-die variation. The proposed technique… CONTINUE READING