Characterizing Quantum Dots for Use in Detecting Subsurface Damage


Polishing, lapping and grinding are finishing processes used to achieve critical surface parameters in a variety of precision applications including optical and electronic components. As these processes remove aberrations on the surface through mechanical and chemical interactions they may induce a stressed layer of cracks below the surface. This subsurface damage can degrade the performance of a final product by creating optical aberrations due to diffraction, premature failure in oscillating components and a reduction in the laser damage threshold of high energy optics [1]. These defects are typically detected by etching or dimpling the surface to expose the underlying damage, both of which are destructive tests.

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@inproceedings{Williams2008CharacterizingQD, title={Characterizing Quantum Dots for Use in Detecting Subsurface Damage}, author={Wesley B. Williams and Brigid A. Mullany and Patrick J.Moyer and Wesley C. Parker and Mark Randles}, year={2008} }