Characterization of submicrometer thickness of copper film on silicon wafer by using pulsed eddy current method

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@article{Qu2011CharacterizationOS, title={Characterization of submicrometer thickness of copper film on silicon wafer by using pulsed eddy current method}, author={Zilian Qu and Qian Zhao and Yonggang Meng}, journal={2011 International Conference on Electric Information and Control Engineering}, year={2011}, pages={1220-1223} }