Characterization of polymer-like thin films deposited on silicon and glass substrates using PECVD method


Polymer-like thin films have been deposited on glass and silicon substrates at temperatures in the range 300–673 K, by a plasma enhanced chemical vapor deposition (PECVD) method using thiophene (C H S) as a precursor. A power with radio 4 4 frequency (13.56 MHz) was applied for the ignition of the plasma, and hydrogen and Ar(argon) were used as the bubbler… (More)


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