Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process

@article{Arshad2007CharacterizationOP,
  title={Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process},
  author={Mohd Khairuddin Md Arshad and Azman Jalar and Ibrahim Ahmad},
  journal={Microelectronics Reliability},
  year={2007},
  volume={47},
  pages={1120-1126}
}
The problem of parasitic residual deposition on the passivation layer in electroless deposition process is studied in this paper. The characterization analysis tools involved are focused ion beam (FIB), scanning electron microscopy (SEM), electron dispersive Xray (EDX) and metallurgical interface analysis. Samples were identified as either good or bad prior… CONTINUE READING