Characterization of micro-bump C4 interconnects for Si-carrier SOP applications

@article{Wright2006CharacterizationOM,
  title={Characterization of micro-bump C4 interconnects for Si-carrier SOP applications},
  author={S. Wright and Robert J. Polastre and Hua Gan and L. Paivikki Buchwalter and Raymond Scott Horton and P. S. Andry and Edmund J. Sprogis and Charulataben L Patel and Cheuk-kan Ken. Tsang and Jacob Knickerbocker and J. Lloyd and Ajit Sharma and M. S. Sri-Jayantha},
  journal={56th Electronic Components and Technology Conference 2006},
  year={2006},
  pages={8 pp.-}
}
This paper describes yield, contact resistance, and preliminary reliability test results on micro-bump C4 interconnects in modules containing Si-chips and Si-carriers. Modules containing eutectic PbSn or SnCu bump solders were fabricated with high yield, with similar interconnect contact resistances for both solders. The contact resistance and reliability test results to date suggest that reliable, high-current, high-density bump interconnections can be achieved for Si-carrier technology 

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References

Publications referenced by this paper.
SHOWING 1-10 OF 21 REFERENCES

Recent advances on electromigration in verylarge-scale-integration of interconnects,

K. N. Tu
  • J. Applied Phys
  • 2003
VIEW 3 EXCERPTS
HIGHLY INFLUENTIAL

A CMOS-compatible process for fabricating electrical through-vias in silicon

  • 56th Electronic Components and Technology Conference 2006
  • 2006
VIEW 1 EXCERPT

A practical implementation of silicon microchannel coolers for high power chips

  • Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.
  • 2005
VIEW 1 EXCERPT

A study of electromigration failure in Pbfree solder joints

M Ding
  • Proc. 43th Int. Reliability Physics Symp.,
  • 2005
VIEW 1 EXCERPT

An evaluation of electromigration performance of SnPb and Pb-free flip chip solder joints,

P Su
  • Proc 55 Electronic Components and Technology Conf., Lake Buena Vista,
  • 2005
VIEW 2 EXCERPTS

Effect of electromigration on mechanical behavior of solder joints

F Ren
  • Proc. Int. Symp. Adv. Packaging Materials,
  • 2005
VIEW 1 EXCERPT

Reliability of Pb-free SnAg solder bumps: Influence of electromigration and temperature,

B Ebersberger
  • Proc 55 Electronic Components and Technology Conf., Lake Buena Vista,
  • 2005
VIEW 3 EXCERPTS

Assembly and reliability of flip chip solder joints using miniaturized Au/Sn bumps

  • 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)
  • 2004
VIEW 1 EXCERPT

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