Characterization of electrostatic carrier substrates to be used as a support for thin semiconductor wafers
@inproceedings{Bock2005CharacterizationOE, title={Characterization of electrostatic carrier substrates to be used as a support for thin semiconductor wafers}, author={Karlheinz Bock and Christof Landesberger and Martin Bleier and Dieter Bollmann and Dieter Hemmetzberger}, year={2005} }
Mobile electrostatic carriers enable secure and reversible attachment of very thin semiconductor wafers by electrostatic forces which are induced by a permanent polarization state of a dielectric layer. The paper reports on the electrical and thermal characterization of electrostatic carriers, also called “Smart Carriers”, prepared by thick film technology on alumina substrates and by thin film technology on silicon substrates. Development work revealed the strong impact of leakage currents…
No Paper Link Available
4 Citations
Carrier techniques for thin wafer processing
- Materials Science
- 2007
Three different types of carrier techniques have been investigated and developed: thermal release tapes, solvable thermoplastic glue layer and mobile electrostatic carrier. These carriers were…
Laser Welding for Processing of Thin Crystalline Si Wafers
- Materials ScienceIEEE Journal of Photovoltaics
- 2015
Thin crystalline Si films (<;100 μm) are used in many applications, such as sensors, photovoltaic absorbers, and optical and particle filters. Such thin crystalline Si films are difficult to handle…
Adhesives for “debonding-on-demand”: Triggered release mechanisms and typical applications
- EngineeringInternational Journal of Adhesion and Adhesives
- 2020
Ultrathin Wafer Pre-Assembly and Assembly Process Technologies: A Review
- Materials Science, Business
- 2015
Ultrathin silicon wafer technology is reviewed in terms of the semiconductor applications, critical challenges, and wafer pre-assembly and assembly process technologies and their underlying…