• Corpus ID: 189925354

Characterization of electrostatic carrier substrates to be used as a support for thin semiconductor wafers

@inproceedings{Bock2005CharacterizationOE,
  title={Characterization of electrostatic carrier substrates to be used as a support for thin semiconductor wafers},
  author={Karlheinz Bock and Christof Landesberger and Martin Bleier and Dieter Bollmann and Dieter Hemmetzberger},
  year={2005}
}
Mobile electrostatic carriers enable secure and reversible attachment of very thin semiconductor wafers by electrostatic forces which are induced by a permanent polarization state of a dielectric layer. The paper reports on the electrical and thermal characterization of electrostatic carriers, also called “Smart Carriers”, prepared by thick film technology on alumina substrates and by thin film technology on silicon substrates. Development work revealed the strong impact of leakage currents… 

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