Characterization of ag nanofilm metallization on copper chip interconnect and its ultrasonic bondability

@article{Tian2009CharacterizationOA,
  title={Characterization of ag nanofilm metallization on copper chip interconnect and its ultrasonic bondability},
  author={Yanhong Tian and Shaowei Zhao and Chunqing Wang},
  journal={2009 International Conference on Electronic Packaging Technology & High Density Packaging},
  year={2009},
  pages={863-866}
}
To improve the bondability of copper chip interconnect, a Si/Ti-Cu-Ag structure was designed and fabricated using evaporation method. Some analytical methods such as SEM, AFM, XRD and XPS were used to characterize the Ag nanofilm metallization and its bondability. It was found that the evaporated Ag metallization has good surface state and samll particle… CONTINUE READING