Characterization of Lead-Free Solder and Sintered Nano-Silver Die-Attach Layers Using Thermal Impedance

@article{Cao2010CharacterizationOL,
  title={Characterization of Lead-Free Solder and Sintered Nano-Silver Die-Attach Layers Using Thermal Impedance},
  author={Xiao Cao and Tao Wang and K. D. T. Ngo and Guo-Quan Lu},
  journal={The 2010 International Power Electronics Conference - ECCE ASIA -},
  year={2010},
  pages={546-552}
}
Since a die-attach layer has a significant impact on the thermal performance of a power module, its quality can be characterized using thermal performance. In this paper, a measurement system for thermal impedance is developed to evaluate three die-attach materials. Thanks to its high temperature sensitivity (10 mV/°C), the gate-emitter voltage of an insulated gate bipolar transistor (IGBT) is used as the temperature-sensitive parameter. The power dissipation in the IGBT remains constant by a… CONTINUE READING
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