Characterization of ICA attachment of SMD on inkjet-printed substrates

Abstract

As electronics industry is moving more and more towards flexible substrates and products more knowledge is needed on new additive production technologies enabling simplified and cost-efficient fabrication of these flexible products. Printable electronics in general is expected to reshape the manufacturing of low-cost mass production of low-end products such… (More)

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Cite this paper

@article{Niittynen2010CharacterizationOI, title={Characterization of ICA attachment of SMD on inkjet-printed substrates}, author={Juha Niittynen and Ville Pekkanen and Matti Mantysalo}, journal={2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)}, year={2010}, pages={990-997} }