Characterization of HDP FSG process


Full factorial design (2 level) is used to study the F% influenced by the different process parameters, gas flow, power etc. X-SEM study on gap-filling and metal top line clipping (metal clipping) is also performed. High temperature vacuum baking is used to study the fluorinated-silicate-glass (FSG) film stability. Dielectric constant of bulk FSG with… (More)


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@article{Hu2006CharacterizationOH, title={Characterization of HDP FSG process}, author={Zheng-Jun Hu and Wen-qiang Li and Shou-Mian Chen and Hong Shi and Wen-Fang Qin}, journal={2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings}, year={2006}, pages={348-350} }