Characterisation of intermetallic growth in copper and gold ball bonds on aluminium metallization

Abstract

While the characterisation of intermetallic coverage and intermetallic phase (IP) growth in gold ball bonding on aluminium is quite well understood, there is relatively little literature concerning the morphology and growth of IP's between Cu balls bonded on aluminium pad metallisation. The difference between Cu-Al IP growth compared with the well known Au… (More)

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@article{Wulff2004CharacterisationOI, title={Characterisation of intermetallic growth in copper and gold ball bonds on aluminium metallization}, author={F. W. Wulff and C. D. Breach and Dominique Stephan and Saraswati and K. J. Dittmer}, journal={Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)}, year={2004}, pages={348-353} }