Challenges of advanced wafer level packaging technology: Cost-effectiveness, integration and scalability

@article{Yoon2012ChallengesOA,
  title={Challenges of advanced wafer level packaging technology: Cost-effectiveness, integration and scalability},
  author={Seung Wook Yoon},
  journal={2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)},
  year={2012},
  pages={451-455}
}
  • Seung Wook Yoon
  • Published 2012 in
    2012 IEEE 14th Electronics Packaging Technology…
Currently various wafer level packaging (WLP) technologies are now cruising at a very high altitude, especially in mobile and portable applications. This is significant trend in packaging business: over 25 billion WLP units are expected to be mounted in smart-phones, tablet PCs or portable devices in 2012. Cost reduction together with miniaturization remains the main driver for adoption of WLP technology. Compared to conventional wire bonding and flipchip packaging, wafer level packaging needs… CONTINUE READING
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