Challenges in aerospace packaging

@article{Pommer2013ChallengesIA,
  title={Challenges in aerospace packaging},
  author={Richard Pommer},
  journal={2013 IEEE Avionics, Fiber-Optics and Photonics Technology Conference (AVFOP)},
  year={2013},
  pages={77-78}
}
  • Richard Pommer
  • Published 2013 in
    2013 IEEE Avionics, Fiber-Optics and Photonics…
We describe packaging technology for low-profile parallel optic transceivers utilized in harsh environment applications that exploits advances made in ASIC packaging. Presently, the cost associated with ceramic hybrid packaging dominates the overall cost of producing transceivers fielded in aerospace systems. While mil-grade electronic components have transitioned from ceramic packaging to modern plastic encapsulated microcircuit (PEM) packaging, OE components in this form of contemporary… CONTINUE READING