Cavity packages for volume MEMS applications

  • Anne Timko Evans
  • Published 2012 in
    2012 35th IEEE/CPMT International Electronics…

Abstract

This article consists of a collection of slides from the author's conference presentation. Some of the specific areas/topics discussed include: MEMS market; cavity package; LGA-FL; formed lid cavity packages; LGA-MC; molded cavity packages; LGA-ML; molded lid cavity packages; MEMS materials; process flow; cavity package modeling and cavity package… (More)
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Topics

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