Castle of Chips: A New Chip Stacking Structure with Wireless Inductive Coupling for Large Scale 3-D Multicore Systems

@article{Amano2012CastleOC,
  title={Castle of Chips: A New Chip Stacking Structure with Wireless Inductive Coupling for Large Scale 3-D Multicore Systems},
  author={Hideharu Amano},
  journal={2012 15th International Conference on Network-Based Information Systems},
  year={2012},
  pages={820-825}
}
The number of stacked chips with wireless inductive coupling interconnect is limited by the physical space for bonding wires of supply voltage. A new chip stacking structure called CoC (Castle on Chips) is proposed for stacking a large number of chips without chip-to-chip wired interconnection. In the CoC, each chip has at least two sets of inductors, and is stacked on two chips in the lower layer shifting in the half chip size. Each chip takes a role of bridge of two chips in the lower layer… CONTINUE READING
3 Extracted Citations
13 Extracted References
Similar Papers

Referenced Papers

Publications referenced by this paper.
Showing 1-10 of 13 references

Principles and Practices of Interconnection Networks

  • W. J. Dally, B. Towles
  • Morgan Kaufmann
  • 2004
Highly Influential
12 Excerpts

Non-Contact 10% Efficient 36mW Power Delivery Unign On-Chip Inductor in 0.18-um CMOS

  • Y. Yuan, Y. Yoshida, T. Kuroda
  • Proceedings of the IEEE Asian Solid-State…
  • 2007
1 Excerpt

Similar Papers

Loading similar papers…