Carrier glass substrates for fan-out wafer/panel level packaging

  • Kazutaka Hayashi
  • Published 2017 in
    2017 International Conference on Electronics…
Inorganic glass is promising material for carrier substrate of fan-out WLP and PLP process due to its stiffness, optical transparency, heat resistance and flatness. In addition, adjustability and flexibility of coefficient of thermal expansion is exceptionally useful to suppress warpage after molding process. In this paper, technical features of glass will… CONTINUE READING