Calculation of Three-Dimensional Passive Structures Including Bond-Wires, Via-Holes and Air-Bridges using the Spectral Domain Analysis Method

@article{Becks1991CalculationOT,
  title={Calculation of Three-Dimensional Passive Structures Including Bond-Wires, Via-Holes and Air-Bridges using the Spectral Domain Analysis Method},
  author={T. Becks and Ingo Wolff},
  journal={1991 21st European Microwave Conference},
  year={1991},
  volume={1},
  pages={571-576}
}
A full-wave analysis method for the investigation of microstrip- and coplanar-structures including bond-wires, via-holes, gate-fingers and air-bridges is presented. For the first time spectral domain analysis technique is used to calculate the S-parameters of real three-dimensional metallization structures. The general formulation and the procedure of the… CONTINUE READING