CTE difference decrease of epoxy molding compound after molding and after PMC

With the rapid development of the semiconductor filed, more and more advanced package types have turned up such as Quad Flat No-lead (QFN), Ball Grill Array (BGA), and so on to meet the requirement of the high O/I function. Followed on, warpage has emerged as a big challenge during cutting and surface mounting process. As packing material, Epoxy molding… CONTINUE READING