CO<inf>2</inf>-laser drilling of TGVs for glass interposer applications

Abstract

Glass as a substrate material for interposer application has many benefits compared to conventional packaging materials like silicon, ceramic or polymer based laminates because of its excellent dielectric and transparent properties. Furthermore, the integration potential of glass is superior because of the dimensional stability under thermal load and the… (More)

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Cite this paper

@article{Brusberg2014COinf2inflaserDO, title={CO2-laser drilling of TGVs for glass interposer applications}, author={Lars Brusberg and Marco Queisser and Marcel Neitz and Henning Schroder and Klaus-Dieter Lang}, journal={2014 IEEE 64th Electronic Components and Technology Conference (ECTC)}, year={2014}, pages={1759-1764} }