CAD-Oriented Equivalent-Circuit Modeling of On-Chip Interconnects on Lossy Silicon Substrate

@inproceedings{Zheng2000CADOrientedEM,
  title={CAD-Oriented Equivalent-Circuit Modeling of On-Chip Interconnects on Lossy Silicon Substrate},
  author={Ji Zheng and Yeon-Chang Hahm and Vijai K. Tripathi and Andreas Weisshaar},
  year={2000}
}
A new, comprehensive CAD-oriented modeling methodology for single and coupled interconnects on an Si–SiO 2 substrate is presented. The modeling technique uses a modified quasi-static spectral domain electromagnetic analysis which takes into account the skin effect in the semiconducting substrate. equivalent-circuit models with only ideal lumped elements, representing the broadband characteristics of the interconnects, are extracted. The response of the proposed SPICE compatible equivalent… CONTINUE READING
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