CAD-Oriented Equivalent-Circuit Modeling of On-Chip Interconnects on Lossy Silicon Substrate

  title={CAD-Oriented Equivalent-Circuit Modeling of On-Chip Interconnects on Lossy Silicon Substrate},
  author={Ji Zheng and Yeon-Chang Hahm and Vijai K. Tripathi and Andreas Weisshaar},
A new, comprehensive CAD-oriented modeling methodology for single and coupled interconnects on an Si–SiO 2 substrate is presented. The modeling technique uses a modified quasi-static spectral domain electromagnetic analysis which takes into account the skin effect in the semiconducting substrate. equivalent-circuit models with only ideal lumped elements, representing the broadband characteristics of the interconnects, are extracted. The response of the proposed SPICE compatible equivalent… CONTINUE READING
Highly Cited
This paper has 89 citations. REVIEW CITATIONS


Publications citing this paper.
Showing 1-10 of 61 extracted citations

89 Citations

Citations per Year
Semantic Scholar estimates that this publication has 89 citations based on the available data.

See our FAQ for additional information.


Publications referenced by this paper.
Showing 1-10 of 28 references

Equivalent circuit modeling of single and coupled on-chip interconnects on lossy silicon substrate

  • J. Zheng, Y.-C. Hahm, A. Weisshaar, V. K. Tripathi
  • inProc. IEEE 8th Topical Meeting Electrical…
  • 1999
1 Excerpt

Frequency-dependent crosstalk simulation for on-chip interconnections

  • A. Deutsch
  • IEEE Trans. Advanced Packaging , vol. 22, Aug…
  • 1999
1 Excerpt

A quasi-TEM spectral domain approach for calculating distributed inductance and resistance of microstrip on Si–SiO substrate,”Electron

  • A. Tripathi, Y. C. Hahm, A. Weisshaar, V. K. Tripathi
  • Lett., vol. 34,
  • 1998
2 Excerpts

Characterization of broad-band transmission for coplanar waveguides on CMOS silicon substrates

  • V. Milanovic, M. Ozgur, D. C. DeGroot, J. A. Jargon, M. Gaitan, M. E. Zaghloul
  • IEEE Trans. Microwave Theory Tech. , vol. 46, pp…
  • 1998
1 Excerpt

Modeling the substrate effect in interconnect line characteristics of high speed VLSI circuits

  • J.-K. Wee, Y.-J. Park, H.-S. Min, D.-H. Cho, M.-H. Seung, H.-S. Park
  • IEEE Trans. Microwave Theory Tech. , vol. 46, pp…
  • 1998
1 Excerpt

Simple formulas to calculate the line parameters of interconnects on conducting substrates

  • H. Grabinski, B. Konrad, P. Nordholz
  • Proc. IEEE 7th Topical Meeting Electrical…
  • 1998
1 Excerpt

Cangellaris, “Simulation of dispersive multiconductor transmission lines by Padé approximation via the Lanczos process,”IEEE

  • A.C.M. Celik
  • Trans. Microwave Theory Tech. ,
  • 1996

Optimal transient simulation of transmission lines

  • D. B. Kuznetsov, J. E. Schutt-Ainé
  • IEEE Trans. Circuits Syst. I , vol. 43, pp. 111…
  • 1996

Similar Papers

Loading similar papers…