Broadband Via-Free Microstrip Balun Using Metamaterial Transmission Lines

  title={Broadband Via-Free Microstrip Balun Using Metamaterial Transmission Lines},
  author={Changjun Liu and Wolfgang Menzel},
  journal={IEEE Microwave and Wireless Components Letters},
A novel metamaterial broadband microstrip balun design is proposed. The broadband balun consists of a pair of identical metamaterial transmission lines. In the odd mode, a virtual ground is formed between the symmetric plane. The odd mode is allowed while the even mode is rejected. No vias are required to realize the shunt inductors of the metamaterial lines, and no power divider is used. Baluns with good performance can be achieved. In this letter, two baluns are fabricated and measured. For… CONTINUE READING
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