Broadband Reduction of Swiching Noise By Embedding High-Density Thin-Film Capacitor In a Laminated Package

Abstract

Broadband noise reduction has been investigated by embedding a high-density thin-film decoupling capacitor as much as 1 μF in a laminate package. A complex programmable logic device (CPLD) was mounted on the laminate package instead of bare chip as a noise generating circuits. Then, the package was mounted on an evaluation board. Eight output buffer… (More)

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Cite this paper

@inproceedings{Kaneko2009BroadbandRO, title={Broadband Reduction of Swiching Noise By Embedding High-Density Thin-Film Capacitor In a Laminated Package}, author={Satoshi Kaneko and Yo Takahahsi and Toshio Sudo and Akiko Sugimoto and Fujio Kuwako}, year={2009} }