Brittle fracture and damage in bond pad stacks: Novel approaches for simulation-based risk assessment

Abstract

We have presented an advanced FEM simulation model that is able to map the scenario of indentation of a diamond tip into a thin brittle SiNx:H film deposited on a Si substrate. Our 2D axisymmetric and 3D quarter and half models are able to reproduce all failure modes observed in preceding indentation experiments. On the one hand, brittle fracture in both… (More)

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