Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration

@article{Yang2017BreakthroughIC,
  title={Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration},
  author={Yu-Tao Yang and T. Yu and Shu-Chiao Kuo and Tai-Yuan Huang and Kai-Ming Yang and Cheng-Ta Ko and Yu-Hua Chen and T. J. Tseng and Kuan-Neng Chen},
  journal={2017 IEEE 67th Electronic Components and Technology Conference (ECTC)},
  year={2017},
  pages={637-642}
}
In this paper, finite element method (FEM) simulations are carried out with pillar-concave structure using silicon substrate, silicon substrate with polyimide (PI) and with polybenzoxazole (PBO) for realization of Cu-Cu bonding at low temperature. Parameters of bonding temperature, pillar diameter, concave sidewall angle, and multilayer of concave structure… CONTINUE READING