• Materials Science
  • Published 2012

Bonding method and a method of manufacturing a semiconductor device

@inproceedings{2012BondingMA,
  title={Bonding method and a method of manufacturing a semiconductor device},
  author={武藤亚弥 and 新饲雅芳},
  year={2012}
}
Bonding method simultaneously joining a plurality of positions in the process of the present invention to provide information which can limit the effects of the time from the supply of the joining material and a method of manufacturing a semiconductor device using the bonding method. The solid form of solder bumps (4) is interposed between the chip (1) and the lead frame (5) between to temporarily assembled. In the solder bumps (4) is formed with a projecting portion projecting in a direction… CONTINUE READING