Board Level Characterization of Pb-free Sn-3.5Ag Versus Eutectic Pb-Sn BGA Solder Joint Reliability

The need to transition to the use of Pb-free solders in the microelectronics industry has resulted in a vast amount of research and development work to identify suitable replacements for eutectic Pb-Sn. Although the near-eutectic ternary Sn-Ag-Cu (SAC) alloys have gained widespread acceptance, they have been found to exhibit poor component and board-level… CONTINUE READING