Bias-Compensated Least Squares Identification of Distributed Thermal Models for Many-Core Systems-on-Chip

Abstract

The thermal wall for many-core systems on-chip calls for advanced management techniques to maximize performance, while capping temperatures. Distributed and compact thermal models are a cornerstone for such techniques. System identification methodologies allow to extract models directly from the target device thermal response. Unfortunately, standard Auto… (More)
DOI: 10.1109/TCSI.2014.2312495

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@article{Diversi2014BiasCompensatedLS, title={Bias-Compensated Least Squares Identification of Distributed Thermal Models for Many-Core Systems-on-Chip}, author={Roberto Diversi and Andrea Tilli and Andrea Bartolini and Francesco Beneventi and Luca Benini}, journal={IEEE Transactions on Circuits and Systems I: Regular Papers}, year={2014}, volume={61}, pages={2663-2676} }