Benchmark heat transfer data for microstructured surfaces for immersion-cooled microelectronics

@article{Nimkar2006BenchmarkHT,
  title={Benchmark heat transfer data for microstructured surfaces for immersion-cooled microelectronics},
  author={N. D. Nimkar and Shanta Bhavnani and R. P. Jaeger},
  journal={IEEE Transactions on Components and Packaging Technologies},
  year={2006},
  volume={29},
  pages={89-97}
}
Pool boiling from a surface featuring micropyramidal reentrant cavities (mouth size 40 /spl mu/m) etched in silicon, bonded to a glass substrate, was studied. All experiments were conducted in the dielectric fluid FC-72 at 1 atm. The heat sink is designed to eliminate spreading through the substrate, and back heat loss. Experimentation showed that the critical heat flux was 12.8 W/cm/sup 2/. A high speed camera (400 frames/s) was used to record and quantify the effect of heat flux on departure… CONTINUE READING

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