Before the Industrial Revolution: European Society and Economy

@inproceedings{Cipolla1977BeforeTI,
  title={Before the Industrial Revolution: European Society and Economy},
  author={Carlo Maria Cipolla},
  year={1977}
}
A plastic packaged semiconductor device having a heat sink includes a semiconductor device which requires ultrasonically bonded leads. External leads are attached to the heat sink and have end portions to which ultrasonic bonds can be made. The lead end portions are separated from the heat sink by a body of insulating material. Preferably, the insulating material is an epoxy adhesive which may contain reinforcing glass fibers. 

Citations

Publications citing this paper.
SHOWING 1-10 OF 21 CITATIONS