BGA brittle fracture - alternative solder joint integrity test methods

@article{Newman2005BGABF,
  title={BGA brittle fracture - alternative solder joint integrity test methods},
  author={Keith Newman},
  journal={Proceedings Electronic Components and Technology, 2005. ECTC '05.},
  year={2005},
  pages={1194-1201 Vol. 2}
}
  • Keith Newman
  • Published 2005 in
    Proceedings Electronic Components and Technology…
A solder ball shear and pull testing study was conducted on 27 unique package constructions, evaluated under a wide variety of test conditions. The study encompassed the coordinated efforts of 7 electronics manufacturers using early-prototype high speed solder ball shear/pull equipment. Shear speeds ranged from a conventional 0.0001 m/s (100 /spl mu/m/s) rate up to as high as 4 m/s, while pull testing ranged from speeds of 0.0005 m/s (500 /spl mu/m/s) to 1.3 m/s. The many package configurations… CONTINUE READING
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