Automotive semiconductor test

Abstract

Meeting the quality and reliability requirements of the ISO 26262 and other automotive electronics standards will only become more difficult as device sizes and complexities continue to grow. New advanced test technologies such as cell-aware ATPG, hybrid compression / logic BIST / memory BIST and diagnosis-driven yield analysis with RCD provide some key building blocks towards ensuring compliance to the new standards. Adoption of these and other advanced test capabilities will not only improve the ability of semiconductor manufacturers to achieve necessary quality and reliability metrics, but will also help to further differentiate their products by delivering embedded test capabilities that can be leveraged by their customers at the system level and in the field.

DOI: 10.1109/VLSI-DAT.2017.7939655

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Cite this paper

@article{Pateras2017AutomotiveST, title={Automotive semiconductor test}, author={Steve Pateras and Ting-Pu Tai}, journal={2017 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)}, year={2017}, pages={1-4} }