Automating wafer-level test of uncooled infrared detectors using wafer-prober

@article{Makhlouf2017AutomatingWT,
  title={Automating wafer-level test of uncooled infrared detectors using wafer-prober},
  author={Mohamed Makhlouf and Diana Goller and Lutz Gendrisch and Stephan Kolnsberg and Franz Vogt and Alexander Utz and Dirk Weiler and Holger Vogt},
  journal={2017 IEEE 23rd International Symposium on On-Line Testing and Robust System Design (IOLTS)},
  year={2017},
  pages={13-16}
}
Fraunhofer IMS develops and fabricates far-infrared focal plane arrays (IRFPA) using microbolometers with a pixel pitch of 17μm technology realized on top of a 0.35 μm CMOS readout integrated circuit (ROIC). The microbolometers are encapsulated by a Chip-Scale-Package (CSP) to ensure a high quality vacuum level. The CSP is realized by placing an infrared… CONTINUE READING