Automated testing of bare die-to-die stacks

@article{Marinissen2015AutomatedTO,
  title={Automated testing of bare die-to-die stacks},
  author={Erik Jan Marinissen and Bart De Wachter and Teng Wang and Jens Fiedler and Jorg Kiesewetter and Karsten Stoll},
  journal={2015 IEEE International Test Conference (ITC)},
  year={2015},
  pages={1-10}
}
Stacking singulated dies is an efficient way to create die stacks; IMEC uses this so-called die-to-die (D2D) stacking approach often to manufacture small to medium volumes of test chips. There is a need to perform a post-bond test on still-unpackaged (`bare') D2D stacks, if only to avoid unnecessary packaging costs. This paper presents an approach to perform automatic stepping and probing on arrays of D2D stacks pick-n-placed (PnP'd) on a carrier substrate. We describe an algorithm for Cascade… CONTINUE READING

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