Author ' s personal copy A computational damage mechanics model for thermomigration

@inproceedings{Li2009AuthorS,
  title={Author ' s personal copy A computational damage mechanics model for thermomigration},
  author={Shidong Li and Cemal Basaran},
  year={2009}
}
Miniaturization of electronics to nanoscale leads to significantly higher current density levels and larger thermal gradients in electronics packaging. Laboratory test data show that thermomigration plays a significant role in high current density induced failure in solder joints and interconnects. In this paper, a computational damage mechanics model for thermomigration process is proposed and implemented in finite element method. This model is based on thermodynamics and formulated by… CONTINUE READING
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