Atomic assembly of Cu/Ta multilayers: Surface roughness, grain structure, misfit dislocations, and amorphization

@article{Francis2007AtomicAO,
  title={Atomic assembly of Cu/Ta multilayers: Surface roughness, grain structure, misfit dislocations, and amorphization},
  author={M. Francis and M. Neurock and Xiaowang Zhou and J. Quan and H. Wadley and E. Webb},
  journal={Journal of Applied Physics},
  year={2007},
  volume={104},
  pages={034310}
}
Molecular dynamics simulations and selected experiments have been carried out to study the growth of Cu films on (010) bcc Ta and the deposition of CuxTa1−x alloy films on (111) fcc Cu. They indicate that fcc Cu films with a (111) texture are always formed when Cu is deposited on Ta surfaces. These films are polycrystalline even when the Ta substrate is single crystalline. The grains have one of two different orientations and are separated by either orientational or misfit dislocations… Expand
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